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A relatively new MIM alloy, Tungsten-Copper is used in electronics and optoelectronic applications for thermal management of device packages and enclosures. It’s thermal conductivity and matched coefficient of thermal expansion makes it ideal for optoelectronic applications.

Physical Properties
Density 15.0 g/cm³
Melting Point

1,450°C

Thermal Conductivity 189 W/m-k
CTE

7.4 ppm/°C

Electrical Conductivity 43.7%IACS
 
Mechanical Properties
Yield Strength 90 ksi
Hardness 20 HRC
 
Analysis
W 80%
Cu 20%

Data provided is typical. Actual parts should be tested for application specific performance.

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