A relatively new MIM alloy, Tungsten-Copper is used in electronics
and optoelectronic applications for thermal management of device packages
and enclosures. Its thermal conductivity and matched coefficient of
thermal expansion makes it ideal for optoelectronic applications.
|Thermal Conductivity||189 W/m-k|
|Yield Strength||90 ksi|
Data provided is typical. Actual parts should be tested for application specific performance.