A relatively new MIM alloy, Tungsten-Copper is used in electronics
and optoelectronic applications for thermal management of device packages
and enclosures. It’s thermal conductivity and matched coefficient of
thermal expansion makes it ideal for optoelectronic applications.
| Physical Properties |
| Density |
16.6 g/cm³ |
| Melting Point |
1,450°C
|
| Thermal Conductivity |
188 W/m-k |
| CTE |
5.8 ppm/°C
|
| Electrical Conductivity |
38%IACS |
| |
| Mechanical Properties |
| Yield Strength |
115 ksi |
| Hardness |
34 HRC |
| |
| Analysis |
Data provided is typical. Actual
parts should be tested for application specific performance.
