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This iron-nickel alloy is used in electronics and
optoelectronic applications for hermetically sealed packages. Its thermal
expansion characteristics enable its use in glass-to-metal seals.
| Physical Properties | |
| Density | 
7.6 g/cm³ |
| Melting Point |
1,450°C |
| CTE (20°C-400°C) | 8.8 ppm/°C |
| Mechanical Properties | |
| Ultimate Tensile Strength |
400 MPa |
| Yield Strength |
|
| Elongation |
|
| Hardness |
110 - 140 HV1 |
| Analysis | |
| Fe | 99.0% |
| Ni | 49.5 - 50.5% |
| C |
0.10% |
Data provided is typical. Actual parts should be tested for application specific performance.