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Copper is traditionally used to fabricate heat sinks for electronics and optoelectronics applications. Its high thermal conductivity allows it to rapidly dissipate heat. Copper parts are frequently plated to eliminate surface oxidation.

Physical Properties
Density 8.6 g/cm³
Melting Point

1,083°C

Thermal Conductivity 370 W/m-k
CTE (20°C-300°C) 16 µm/m-°C
 
Mechanical Properties
Ultimate Tensile Strength 200 MPa
Elongation

60%

Yield Strength

30 MPa

 
Analysis
Cu 99.0%

Data provided is typical. Actual parts should be tested for application specific performance.