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Copper is traditionally used to fabricate heat sinks
for electronics and optoelectronics applications. Its high thermal conductivity
allows it to rapidly dissipate heat. Copper parts are frequently plated to
eliminate surface oxidation.
| Physical Properties | |
| Density | 8.6 g/cm³ |
| Melting Point |
1,083°C |
| Thermal Conductivity | 370 W/m-k |
| CTE (20°C-300°C) | 16 µm/m-°C |
| Mechanical Properties | |
| Ultimate Tensile Strength | 200 MPa |
| Elongation |
60% |
| Yield Strength |
30 MPa |
| Analysis | |
| Cu | 99.0% |
Data provided is typical. Actual parts should be tested for application specific performance.