Copper is traditionally used to fabricate heat sinks
for electronics and optoelectronics applications. Its high thermal conductivity
allows it to rapidly dissipate heat. Copper parts are frequently plated to
eliminate surface oxidation.
|Thermal Conductivity||370 W/m-k|
|CTE (20°C-300°C)||16 µm/m-°C|
|Ultimate Tensile Strength||200 MPa|
Data provided is typical. Actual parts should be tested for application specific performance.